Description
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
Product Details
- Published:
- 06/01/2015
- Number of Pages:
- 3
- File Size:
- 1 file , 130 KB
Original price was: $42.00.$21.00Current price is: $21.00.
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
standard by ASTM International, 06/01/2015
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility