Description

Published annually in April. 

This volume contains 153 standards. 

Subjects cover: 

• Innerlayer Interconnections and Bonding
• Materials and Processes for Vacuum Tubes
• Electronic Device Characterization
• Hermetic Seals
• Hybrid Circuits and Substrates
• Microelectronic Packaging
• Leak Testing
• and more
• Declarable substances in materials
• 3D imaging systems
• Additive manufacturing technologies

Product Details

Published:

04/01/2022

ISBN(s):

9781682218716

Number of Pages:

1330

Note:

This product is unavailable in Belarus, Russia, Ukraine